Pressure activated diaphragm bonder
Abstract
A device is available for bonding one component to another, particularly for bonding electronic components of integrated circuits, such as chips, to a substrate. The bonder device in one embodiment includes a bottom metal block having a machined opening wherein a substrate is located, a template having machined openings which match solder patterns on the substrate, a thin diaphragm placed over the template after the chips have been positioned in the openings therein, and a top metal block positioned over the diaphragm and secured to the bottom block, with the diaphragm retained therebetween. The top block includes a countersink portion which extends over at least the area of the template and an opening through which a high pressure inert gas is supplied to exert uniform pressure distribution over the diaphragm to keep the chips in place during soldering. A heating means is provided to melt the solder patterns on the substrate and thereby solder the chips thereto.
- Inventors:
-
- Antioch, CA
- Livermore, CA
- Issue Date:
- Research Org.:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- OSTI Identifier:
- 870965
- Patent Number(s):
- 5632434
- Assignee:
- Regents of University of California (Oakland, CA)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- W-7405-ENG-48
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- pressure; activated; diaphragm; bonder; device; available; bonding; component; particularly; electronic; components; integrated; circuits; chips; substrate; embodiment; bottom; metal; block; machined; located; template; openings; match; solder; patterns; placed; positioned; therein; top; secured; retained; therebetween; countersink; portion; extends; inert; gas; supplied; exert; uniform; distribution; soldering; heating; means; provided; melt; thereto; pressure distribution; heating means; openings therein; inert gas; integrated circuits; integrated circuit; electronic components; bottom block; metal block; uniform pressure; pressure activated; /228/156/
Citation Formats
Evans, Leland B, and Malba, Vincent. Pressure activated diaphragm bonder. United States: N. p., 1997.
Web.
Evans, Leland B, & Malba, Vincent. Pressure activated diaphragm bonder. United States.
Evans, Leland B, and Malba, Vincent. Wed .
"Pressure activated diaphragm bonder". United States. https://www.osti.gov/servlets/purl/870965.
@article{osti_870965,
title = {Pressure activated diaphragm bonder},
author = {Evans, Leland B and Malba, Vincent},
abstractNote = {A device is available for bonding one component to another, particularly for bonding electronic components of integrated circuits, such as chips, to a substrate. The bonder device in one embodiment includes a bottom metal block having a machined opening wherein a substrate is located, a template having machined openings which match solder patterns on the substrate, a thin diaphragm placed over the template after the chips have been positioned in the openings therein, and a top metal block positioned over the diaphragm and secured to the bottom block, with the diaphragm retained therebetween. The top block includes a countersink portion which extends over at least the area of the template and an opening through which a high pressure inert gas is supplied to exert uniform pressure distribution over the diaphragm to keep the chips in place during soldering. A heating means is provided to melt the solder patterns on the substrate and thereby solder the chips thereto.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Wed Jan 01 00:00:00 EST 1997},
month = {Wed Jan 01 00:00:00 EST 1997}
}