Microelectronic device package with an integral window
Abstract
An apparatus for packaging of microelectronic devices, including an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can include a cofired ceramic frame or body. The package can have an internal stepped structure made of one or more plates, with apertures, which are patterned with metallized conductive circuit traces. The microelectronic device can be flip-chip bonded on the plate to these traces, and oriented so that the light-sensitive side is optically accessible through the window. A cover lid can be attached to the opposite side of the package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed. The package body can be formed by low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. Multiple chips can be located within a single package. The cover lid can include a window. The apparatus is particularly suited for packaging of MEMS devices, since the number of handling steps is greatly reduced, thereby reducing the potentialmore »
- Inventors:
-
- Albuquerque, NM
- Tijeras, NM
- Issue Date:
- Research Org.:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- OSTI Identifier:
- 874408
- Patent Number(s):
- 6384473
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81B - MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- microelectronic; device; package; integral; window; apparatus; packaging; devices; including; semiconductor; chip; ccd; cmos; vcsel; laser; diode; mems; imems; cofired; ceramic; frame; internal; stepped; structure; plates; apertures; patterned; metallized; conductive; circuit; traces; flip-chip; bonded; plate; oriented; light-sensitive; optically; accessible; cover; lid; attached; opposite; result; compact; low-profile; hermetically-sealed; formed; low-temperature; ltcc; high-temperature; htcc; multilayer; processes; simultaneously; joined; processing; multiple; chips; located; single; suited; handling; steps; greatly; reduced; reducing; potential; contamination; laser diode; mems device; semiconductor chip; electronic device; /257/
Citation Formats
Peterson, Kenneth A, and Watson, Robert D. Microelectronic device package with an integral window. United States: N. p., 2002.
Web.
Peterson, Kenneth A, & Watson, Robert D. Microelectronic device package with an integral window. United States.
Peterson, Kenneth A, and Watson, Robert D. Tue .
"Microelectronic device package with an integral window". United States. https://www.osti.gov/servlets/purl/874408.
@article{osti_874408,
title = {Microelectronic device package with an integral window},
author = {Peterson, Kenneth A and Watson, Robert D},
abstractNote = {An apparatus for packaging of microelectronic devices, including an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can include a cofired ceramic frame or body. The package can have an internal stepped structure made of one or more plates, with apertures, which are patterned with metallized conductive circuit traces. The microelectronic device can be flip-chip bonded on the plate to these traces, and oriented so that the light-sensitive side is optically accessible through the window. A cover lid can be attached to the opposite side of the package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed. The package body can be formed by low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. Multiple chips can be located within a single package. The cover lid can include a window. The apparatus is particularly suited for packaging of MEMS devices, since the number of handling steps is greatly reduced, thereby reducing the potential for contamination.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jan 01 00:00:00 EST 2002},
month = {Tue Jan 01 00:00:00 EST 2002}
}