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Title: In-situ sputtering apparatus

Abstract

A sputtering apparatus that includes at least a target presented as an inner surface of a confinement structure, the inner surface of the confinement structure is preferably an internal wall of a circular tube. A cathode is disposed adjacent the internal wall of the circular tube. The cathode preferably provides a hollow core, within which a magnetron is disposed. Preferably, an actuator is attached to the magnetron, wherein a position of the magnetron within the hollow core is altered upon activation of the actuator. Additionally, a carriage supporting the cathode and communicating with the target is preferably provided, and a cable bundle interacting with the cathode and linked to a cable bundle take up mechanism provided power and coolant to the cathode, magnetron, actuator and an anode of the sputtering apparatus.

Inventors:
; ; ;
Issue Date:
Research Org.:
Brookhaven National Laboratory (BNL), Upton, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1183936
Patent Number(s):
9051638
Application Number:
13/782,270
Assignee:
Brookhaven Science Associates, LLC (Upton, NY)
Patent Classifications (CPCs):
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01J - ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
DOE Contract Number:  
AC02-98CH10886
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
70 PLASMA PHYSICS AND FUSION TECHNOLOGY; 42 ENGINEERING

Citation Formats

Erickson, Mark R., Poole, Henry J., Custer, III, Arthur W., and Hershcovitch, Ady. In-situ sputtering apparatus. United States: N. p., 2015. Web.
Erickson, Mark R., Poole, Henry J., Custer, III, Arthur W., & Hershcovitch, Ady. In-situ sputtering apparatus. United States.
Erickson, Mark R., Poole, Henry J., Custer, III, Arthur W., and Hershcovitch, Ady. Tue . "In-situ sputtering apparatus". United States. https://www.osti.gov/servlets/purl/1183936.
@article{osti_1183936,
title = {In-situ sputtering apparatus},
author = {Erickson, Mark R. and Poole, Henry J. and Custer, III, Arthur W. and Hershcovitch, Ady},
abstractNote = {A sputtering apparatus that includes at least a target presented as an inner surface of a confinement structure, the inner surface of the confinement structure is preferably an internal wall of a circular tube. A cathode is disposed adjacent the internal wall of the circular tube. The cathode preferably provides a hollow core, within which a magnetron is disposed. Preferably, an actuator is attached to the magnetron, wherein a position of the magnetron within the hollow core is altered upon activation of the actuator. Additionally, a carriage supporting the cathode and communicating with the target is preferably provided, and a cable bundle interacting with the cathode and linked to a cable bundle take up mechanism provided power and coolant to the cathode, magnetron, actuator and an anode of the sputtering apparatus.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jun 09 00:00:00 EDT 2015},
month = {Tue Jun 09 00:00:00 EDT 2015}
}

Works referenced in this record:

Sputtering device
patent, September 1980


Magnetron sputtering cathode with magnet disposed between two yoke plates
patent, February 2002


Treatment of etching chambers using activated cleaning gas
patent, April 2002


Analytical method and apparatus
patent, October 2002


Method and apparatus for producing MIIIN columns and MIIIN materials grown thereon
patent, February 2004


Resistivity stable electrically conductive films formed from polythiophenes
patent, December 2010


Wear resistant vapor deposited coating, method of coating deposition and applications therefor
patent, May 2011


Metal complex compositions and methods for making metal-containing films
patent, January 2013