Apparatus and method for rapid cooling of large area substrates in vacuum
Abstract
The present invention is directed to an apparatus and method for rapid cooling of a large substrate in a vacuum environment. A first cooled plate is brought into close proximity with one surface of a flat substrate. The spatial volume between the first cooling plate and the substrate is sealed and brought to a higher pressure than the surrounding vacuum level to increase the cooling efficiency. A second cooled plate is brought into close proximity with the opposite surface of the flat substrate. A second spatial volume between the second cooling plate and the substrate is sealed and the gas pressure is equalized to the gas pressure in the first spatial volume. The equalization of the gas pressure on both sides of the flat substrate eliminates deflection of the substrate and bending stress in the substrate.
- Inventors:
- Issue Date:
- Research Org.:
- Abound Solar, Inc., Loveland, CO (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1176414
- Patent Number(s):
- 7803419
- Application Number:
- 11/525,456
- Assignee:
- Abound Solar, Inc. (Loveland, CO)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C03 - GLASS C03C - CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION; 36 MATERIALS SCIENCE
Citation Formats
Barth, Kurt L., Enzenroth, Robert A., and Sampath, Walajabad S. Apparatus and method for rapid cooling of large area substrates in vacuum. United States: N. p., 2010.
Web.
Barth, Kurt L., Enzenroth, Robert A., & Sampath, Walajabad S. Apparatus and method for rapid cooling of large area substrates in vacuum. United States.
Barth, Kurt L., Enzenroth, Robert A., and Sampath, Walajabad S. Tue .
"Apparatus and method for rapid cooling of large area substrates in vacuum". United States. https://www.osti.gov/servlets/purl/1176414.
@article{osti_1176414,
title = {Apparatus and method for rapid cooling of large area substrates in vacuum},
author = {Barth, Kurt L. and Enzenroth, Robert A. and Sampath, Walajabad S.},
abstractNote = {The present invention is directed to an apparatus and method for rapid cooling of a large substrate in a vacuum environment. A first cooled plate is brought into close proximity with one surface of a flat substrate. The spatial volume between the first cooling plate and the substrate is sealed and brought to a higher pressure than the surrounding vacuum level to increase the cooling efficiency. A second cooled plate is brought into close proximity with the opposite surface of the flat substrate. A second spatial volume between the second cooling plate and the substrate is sealed and the gas pressure is equalized to the gas pressure in the first spatial volume. The equalization of the gas pressure on both sides of the flat substrate eliminates deflection of the substrate and bending stress in the substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Sep 28 00:00:00 EDT 2010},
month = {Tue Sep 28 00:00:00 EDT 2010}
}