Maintainable substrate carrier for electroplating
Abstract
One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The carrier includes a non-conductive carrier body on which the substrates are placed and conductive lines embedded within the carrier body. A plurality of conductive clip attachment parts are attached in a permanent manner to the conductive lines embedded within the carrier body. A plurality of contact clips are attached in a removable manner to the clip attachment parts. The contact clips hold the substrates in place and conductively connecting the substrates with the conductive lines. Other embodiments, aspects and features are also disclosed.
- Inventors:
-
- Milpitas, CA
- Laguna, PH
- Cavite, PH
- Batangas, PH
- Saratoga, CA
- Issue Date:
- Research Org.:
- SunPower Corporation (San Jose, CA)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1068843
- Patent Number(s):
- 8221601
- Application Number:
- 12/889,232
- Assignee:
- SunPower Corporation (San Jose, CA)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
- DOE Contract Number:
- FC36-07GO17043
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Chen, Chen-An, Abas, Emmanuel Chua, Divino, Edmundo Anida, Ermita, Jake Randal G, Capulong, Jose Francisco S, Castillo, Arnold Villamor, Ma,, and Xiaobing, Diana. Maintainable substrate carrier for electroplating. United States: N. p., 2012.
Web.
Chen, Chen-An, Abas, Emmanuel Chua, Divino, Edmundo Anida, Ermita, Jake Randal G, Capulong, Jose Francisco S, Castillo, Arnold Villamor, Ma,, & Xiaobing, Diana. Maintainable substrate carrier for electroplating. United States.
Chen, Chen-An, Abas, Emmanuel Chua, Divino, Edmundo Anida, Ermita, Jake Randal G, Capulong, Jose Francisco S, Castillo, Arnold Villamor, Ma,, and Xiaobing, Diana. Tue .
"Maintainable substrate carrier for electroplating". United States. https://www.osti.gov/servlets/purl/1068843.
@article{osti_1068843,
title = {Maintainable substrate carrier for electroplating},
author = {Chen, Chen-An and Abas, Emmanuel Chua and Divino, Edmundo Anida and Ermita, Jake Randal G and Capulong, Jose Francisco S and Castillo, Arnold Villamor and Ma, and Xiaobing, Diana},
abstractNote = {One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The carrier includes a non-conductive carrier body on which the substrates are placed and conductive lines embedded within the carrier body. A plurality of conductive clip attachment parts are attached in a permanent manner to the conductive lines embedded within the carrier body. A plurality of contact clips are attached in a removable manner to the clip attachment parts. The contact clips hold the substrates in place and conductively connecting the substrates with the conductive lines. Other embodiments, aspects and features are also disclosed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jul 17 00:00:00 EDT 2012},
month = {Tue Jul 17 00:00:00 EDT 2012}
}
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