Electronic circuits having NiAl and Ni.sub.3 Al substrates

Patent · Fri Jan 01 00:00:00 EST 1999

OSTI ID:872577

Deevi, Seetharama C ^[1]; Sikka, Vinod K ^[2]

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1. Midlothian, VA
2. Oak Ridge, TN

An electronic circuit component having improved mechanical properties and thermal conductivity comprises NiAl and/or Ni.sub.3 Al, upon which an alumina layer is formed prior to applying the conductive elements. Additional layers of copper-aluminum alloy or copper further improve mechanical strength and thermal conductivity.

• Research Organization: Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
• DOE Contract Number: AC05-84OR21400
• Assignee: Lockheed Martin Energy Research Corporation (Oak Ridge, TN)
• Patent Number(s): US 5965274
• OSTI ID: 872577
• Country of Publication: United States
• Language: English

Related Subjects

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copper
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thermal conductivity
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formed prior
additional layer
conductivity comprises
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