Electronic circuits having NiAl and Ni{sub 3}Al substrates
Patent
·
OSTI ID:20013803
An electronic circuit component having improved mechanical properties and thermal conductivity comprises NiAl and/or Ni{sub 3}Al, upon which an alumina layer is formed prior to applying the conductive elements. Additional layers of copper-aluminum alloy or copper further improve mechanical strength and thermal conductivity.
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC05-84OR21400
- OSTI ID:
- 20013803
- Resource Relation:
- Other Information: PBD: 12 Oct 1999
- Country of Publication:
- United States
- Language:
- English
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OSTI ID:20013803