Development and process control for rigid/flex, multilayer printed wiring boards

Technical Report · Sat Aug 01 00:00:00 EDT 1987

OSTI ID:6408960

Gentry, F L

Rigid/flex multilayers require certain unique processing parameters not common to conventional printed wiring products: special machining of windows, the use of no-flow prepreg adhesives, plasma etching of nonhomogeneous material compositions, and more stringent plating controls. Performance of these products can be predicted by modeling studies and verified by physical testing. Thermophysical characteristics are described as well as the establishment of rigid/flex capabilities in a development laboratory. The actual fabrication processing steps are also described for high-reliability, six-layer rigid/flex boards whose two center layers are flexible circuitry.

• Research Organization: Sandia National Labs., Albuquerque, NM (USA)
• DOE Contract Number: AC04-76DP00789
• OSTI ID: 6408960
• Report Number(s): SAND-86-1555; ON: DE87012845
• Resource Relation: Other Information: Portions of this document are illegible in microfiche products. Original copy available until stock is exhausted
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
PRINTED CIRCUITS
FABRICATION
LAYERS
PROCESSING
ELECTRONIC CIRCUITS
420800* - Engineering- Electronic Circuits & Devices- (-1989)