Stress analysis of plated-through-holes in rigid flex multilayer printed wiring boards

Conference · Wed Jan 01 00:00:00 EST 1992

OSTI ID:5464090

Burchett, S N

A rigid/flex printed wiring board is a hybridized system of wiring interconnects utilizing the concepts of both multilayer and flexible circuit technology. This type of printed wiring board offers significant advantages in the production of complex electronic assemblies. In contrast to standard printed wiring board assemblies which are homogeneous in material composition, rigid/flex assemblies have a combination of different laminates, films, and adhesives arranged to accomplish the electrical and mechanical design goals. After lamination, the circuit layers are interconnected using plated-through-hole technology. Associated with the plated-through-holes are at least two observed failure modes, barrel cracks and inner layer foil cracks, that develop during thermal testing of completed printed wiring board assemblies. Due to these failures, there is concern about the reliability of such systems. This paper presents the results from finite element stress analyses employed to assist in the understanding of failure modes in a plated-through-hole of a rigid/flex multilayer printed wiring board. The results of the analyses provided substantial insight about the thermal-structural response of the assembly and provided guidance to process improvements aimed at eliminating the failures. 6 refs.

• Research Organization: Sandia National Labs., Albuquerque, NM (United States)
• Sponsoring Organization: USDOE; USDOE, Washington, DC (United States)
• DOE Contract Number: AC04-76DP00789
• OSTI ID: 5464090
• Report Number(s): SAND-92-0271C; CONF-9204115-1; ON: DE92011659
• Resource Relation: Conference: 35. Institute for Interconnecting and Packaging Electronic Circuits (IPC) annual meeting, Bel Harbor, FL (United States), 5-10 Apr 1992
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
36 MATERIALS SCIENCE
PRINTED CIRCUITS
STRESS ANALYSIS
ADHESIVES
COPPER
CRACKS
FAILURE MODE ANALYSIS
FINITE ELEMENT METHOD
IMIDES
LAYERS
STRAINS
STRESSES
YOUNG MODULUS
ELECTRONIC CIRCUITS
ELEMENTS
MECHANICAL PROPERTIES
METALS
NUMERICAL SOLUTION
ORGANIC COMPOUNDS
ORGANIC NITROGEN COMPOUNDS
SYSTEM FAILURE ANALYSIS
SYSTEMS ANALYSIS
TRANSITION ELEMENTS
426000* - Engineering- Components
Electron Devices & Circuits- (1990-)
360103 - Metals & Alloys- Mechanical Properties