Determination of aqueous processable photoresist in tin-lead plating solutions

Technical Report · Mon Jul 01 00:00:00 EDT 1991

OSTI ID:5564555

Smith, R E

A method based on reverse phase liquid chromatography has been developed for determining the solubility of Dynachem's HG aqueous processable photoresist in tin-lead plating baths. This photoresist is processed with aqueous products, alleviating the need for chlorinated solvents previously used with non-aqueous resists. It is separated from other plating solution components on a poly(styrene/divinylbenzene) column using a 90% acetonitrile eluent. An ultraviolet (UV) detector at 252 nm was used for quantitation. Five replicate analyses had a relative standard deviation of 4.63%. This method was used to measure photoresist drag-in the current production tin-lead plating bath, which contains peptone (Tank Number TL-25), and in three different tin-lead baths that are being evaluated as replacements. Spectroscopic analysis of Dynachem HG indicated that it contains a bis azide photoinitiator that cross-links with an acrylate polymer upon exposure to ultraviolet light. The final purpose of this method was to determine if the tin-lead chemistries were compatible with Dynachem HG aqueous photoresist. 6 refs., 13 figs., 3 tabs.

• Research Organization: Allied-Signal Aerospace Co., Kansas City, MO (United States). Kansas City Div.
• Sponsoring Organization: USDOE; USDOE, Washington, DC (United States)
• DOE Contract Number: AC04-76DP00613
• OSTI ID: 5564555
• Report Number(s): KCP-613-4371; ON: DE91015575
• Country of Publication: United States
• Language: English

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