Converting printed wiring product processing to aqueous processable dry film photoresist. Final report

Technical Report · Mon Jul 01 00:00:00 EDT 1996

DOI:https://doi.org/10.2172/266640· OSTI ID:266640

Goldammer, S E

Fully aqueous processable dry film photoresists were evaluated to determine which dry film in the Federal Manufacturing and Technologies printed wiring board facility performed the best. The photoresists were chosen for their compatibility in alkaline etching, copper electroplating, and tin-lead electroplating. The processing evaluation included both single layer and double layer dry film photoresist for pattern plating.

• Research Organization: Allied-Signal Aerospace Co., Kansas City, MO (United States)
• Sponsoring Organization: USDOE, Washington, DC (United States)
• DOE Contract Number: AC04-76DP00613
• OSTI ID: 266640
• Report Number(s): KCP-613-5692; ON: DE96012956; TRN: AHC29616%%37
• Resource Relation: Other Information: PBD: Jul 1996
• Country of Publication: United States
• Language: English

Related Subjects

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION
42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES
PRINTED CIRCUITS
MANUFACTURING
CHLOROFLUOROCARBONS
MATERIAL SUBSTITUTION
CHLORINATED ALIPHATIC HYDROCARBONS
PROGRESS REPORT
PHOTORESISTORS
PERFORMANCE
ELECTROPLATING
ETCHING
COMPATIBILITY
AQUEOUS SOLUTIONS
PATTERN RECOGNITION
IMAGE PROCESSING
MASKING
REMOVAL