Influence of small additions of Bi and Sn in solder on the wettability, work of adhension, and contact resistance at the interface between single crystals of solid solutions of the Bi-Sb system
This paper studies the influence of small additions of bismuth and tin on the surface tension of Wood's alloy, the equilibrium contact angle, and the work of adhesion when crystals are wetted with the solder alloy, as well as on the value of the contact resistance. The specimens for the investigations were cut from single crystal boules of compositions Bi/sub 91/ Sb/sub 9/, Bi/sub 93/ Sb/sub 7/, and Bi/sub 94/ Sb/sub 6/, which were grown by the Czochralski method of pulling from the liquid phase with a concurrent replenishing supply of solid antimony to the melt. It has been shown that small additions of bismuth and tin to solder significantly affect the adhesion and electrical phenomena at the interface between the solder and crystals of solid solutions. A correlation has been found between the adhesion characteristics and the electrical characteristic of contacts obtained at the interface between the indicated crystals and Wood's alloy.
- OSTI ID:
- 5462510
- Journal Information:
- Inorg. Mater. (Engl. Transl.); (United States), Vol. 21:11
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
ANTIMONY ALLOYS
ADHESION
WETTABILITY
BISMUTH
METALLURGICAL EFFECTS
BISMUTH ALLOYS
INTERMETALLIC COMPOUNDS
TIN
CARRIER MOBILITY
CZOCHRALSKI METHOD
DIFFUSION
ELECTRIC CONDUCTIVITY
HOLE MOBILITY
METALLURGICAL FLUX
N-TYPE CONDUCTORS
SOLDERED JOINTS
SOLDERING
SURFACE TENSION
THERMOELECTRIC PROPERTIES
ALLOYS
CRYSTAL GROWTH METHODS
ELECTRICAL PROPERTIES
ELEMENTS
FABRICATION
JOINING
JOINTS
MATERIALS
METALS
MOBILITY
PHYSICAL PROPERTIES
PNICTIDES
SEMICONDUCTOR MATERIALS
SURFACE PROPERTIES
WELDING
360104* - Metals & Alloys- Physical Properties
360102 - Metals & Alloys- Structure & Phase Studies