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Title: Deposition of Cu films for laser mirror by partially ionized beam deposition

Book ·
OSTI ID:477425
; ; ; ;  [1]
  1. Korea Inst. of Science and Technology, Seoul (Korea, Republic of). Div. of Ceramics

Partially ionized beam deposition of Cu thin films on glass at room temperature were carried out to fabricate Cu laser mirrors with good structural and reflectance properties. At a constant film thickness of 600 {angstrom}, the grain size of as-grown Cu films increased with acceleration voltage, and there was no indication of defects such as cracks and/or large pores in the film surface as shown in scanning electron microscopy images. Root-mean-square (R{sub ms}) surface roughnesses of the films with thicknesses of 600 {angstrom} were measured by atomic force microscopy. R{sub ms} surface roughness increased when acceleration voltage increased from 0 kV to 2 kV, but decreased at the acceleration voltage of 3 kV. R{sub ms} surface roughness of the film grown at 4 kV, however, increased again. At the acceleration voltage of 3 kV, reflectance of the films increased with the film thickness until 600 {angstrom} and decreased at the film thickness of 800 {angstrom}. The reflectance results showed that the Cu film deposited at 3 kV had higher reflectance than that of others. The results suggest that it is possible to grow the Cu film with good structural and optical properties on glass substrate at room temperature by partially ionized beam deposition.

OSTI ID:
477425
Report Number(s):
CONF-951155-; ISBN 1-55899-299-5; TRN: IM9724%%302
Resource Relation:
Conference: Fall meeting of the Materials Research Society (MRS), Boston, MA (United States), 27 Nov - 1 Dec 1995; Other Information: PBD: 1996; Related Information: Is Part Of Ion-solid interactions for materials modification and processing; Poker, D.B. [ed.] [Oak Ridge National Lab., TN (United States)]; Ila, D. [ed.] [Alabama A and M Univ., Normal, AL (United States)]; Cheng, Y.T. [ed.] [General Motors Corp., Warren, MI (United States)]; Harriott, L.R. [ed.] [AT and T Bell Labs., Murray Hill, NJ (United States)]; Sigmon, T.W. [ed.] [Arizona State Univ., Tempe, AZ (United States)]; PB: 923 p.; Materials Research Society symposium proceedings, Volume 396
Country of Publication:
United States
Language:
English