High energy electron beam curing of epoxy resin systems incorporating cationic photoinitiators
Patent
·
OSTI ID:335458
A mixture of epoxy resins such as a semi-solid triglycidyl ether of tris (hydroxyphenyl) methane and a low viscosity bisphenol A glycidyl ether and a cationic photoinitiator such as a diaryliodonium salt is cured by irradiating with a dosage of electron beams from about 50 to about 150 kGy, forming a cross-linked epoxy resin polymer.
- Research Organization:
- Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC05-84OR21400
- Assignee:
- Lockheed Martin Energy Systems, Inc., Oak Ridge, TN (United States)
- Patent Number(s):
- US 5,877,229/A/
- Application Number:
- PAN: 8-507,569; TRN: 99:004583
- OSTI ID:
- 335458
- Resource Relation:
- Other Information: PBD: 2 Mar 1999
- Country of Publication:
- United States
- Language:
- English
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