High temperature coefficient of resistance of low-temperature-grown VO{sub 2} films on TiO{sub 2}-buffered SiO{sub 2}/Si (100) substrates
- DENSO Corporation, Aichi 470-0111 (Japan)
- National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba 305-8562 (Japan)
The introduction of a TiO{sub 2} buffer layer significantly improved the temperature coefficient of resistance (TCR), a measure of the sharpness of the metal–insulator transition, for films of VO{sub 2} grown on SiO{sub 2}/Si (100) substrates at growth temperatures below 670 K. X-ray diffraction and Raman scattering measurements revealed that polycrystalline VO{sub 2} films were formed on the TiO{sub 2}-buffered substrates at low temperatures below 600 K, whereas amorphous films were formed at these temperatures on SiO{sub 2}/Si (100) substrates without a TiO{sub 2} buffer layer. Electron microscopy studies confirmed that the TiO{sub 2} buffer layer enhanced the grain growth of VO{sub 2} films at low growth temperatures. The VO{sub 2} films grown at 600 K on TiO{sub 2}-buffered substrates showed a large TCR of more than 80%/K as a result of the improved crystallinity and grain size of the VO{sub 2} films. Our results provide an effective approach toward the integration of VO{sub 2}-based devices onto Si platforms at process temperatures below 670 K.
- OSTI ID:
- 22494706
- Journal Information:
- Journal of Applied Physics, Vol. 118, Issue 5; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0021-8979
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
71 CLASSICAL AND QUANTUM MECHANICS
GENERAL PHYSICS
ELECTRON MICROSCOPY
GRAIN GROWTH
GRAIN SIZE
POLYCRYSTALS
RAMAN EFFECT
SILICON
SILICON OXIDES
SUBSTRATES
TEMPERATURE DEPENDENCE
TEMPERATURE RANGE 0273-0400 K
TEMPERATURE RANGE 0400-1000 K
THIN FILMS
TITANIUM OXIDES
VANADIUM OXIDES
X-RAY DIFFRACTION