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Title: Method for atmospheric pressure reactive atom plasma processing for surface modification

Patent ·
OSTI ID:988697
 [1]
  1. Livermore, CA
+ Show Author Affiliations

Reactive atom plasma processing can be used to shape, polish, planarize and clean the surfaces of difficult materials with minimal subsurface damage. The apparatus and methods use a plasma torch, such as a conventional ICP torch. The workpiece and plasma torch are moved with respect to each other, whether by translating and/or rotating the workpiece, the plasma, or both. The plasma discharge from the torch can be used to shape, planarize, polish, and/or clean the surface of the workpiece, as well as to thin the workpiece. The processing may cause minimal or no damage to the workpiece underneath the surface, and may involve removing material from the surface of the workpiece.

Research Organization:
Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
W-7405-ENG-48
Assignee:
RAPT Industries, Inc. (Fremont, CA)
Patent Number(s):
7,591,957
Application Number:
10/002,483
OSTI ID:
988697
Country of Publication:
United States
Language:
English

References (4)

Rapid, noncontact optical figuring of aspheric surfaces with plasma-assisted chemical etching conference November 1990
Production of chemically active species in the air by a single positive streamer in a nonuniform field journal June 1997
Computer numerically controlled plasma chemical vaporization machining with a pipe electrode for optical fabrication journal January 1998
Rapid, noncontact, damage free shaping of optical and other surfaces with plasma assisted chemical etching conference January 1989

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