Thermal Management of Power Semiconductor Packages - Matching Cooling Technologies with Packaging Technologies (Presentation)

Conference · Tue Apr 27 00:00:00 EDT 2010

OSTI ID:983418

Bennion, K; Moreno, G

Heat removal for power semiconductor devices is critical for robust operation. Because there are different packaging options, different thermal management technologies, and a range of applications, there is a need for a methodology to match cooling technologies and package configurations to target applications. To meet this need, a methodology was developed to compare the sensitivity of coolingtechnologies on the overall package thermal performance over a range of power semiconductor packaging configurations. The results provide insight into the trade-offs associated with cooling technologies and package configurations. The approach provides a method for comparing new developments in power semiconductor packages and identifying potential thermal control technologies for the package.The results can help users select the appropriate combination of packaging configuration and cooling technology for the desired application.

• Research Organization: National Renewable Energy Lab. (NREL), Golden, CO (United States)
• Sponsoring Organization: USDOE Office of Energy Efficiency and Renewable Energy (EERE)
• DOE Contract Number: AC36-08GO28308
• OSTI ID: 983418
• Report Number(s): NREL/PR-540-48147; TRN: US201014%%320
• Resource Relation: Conference: Presented at the IMAPS 2nd Advanced Technology Workshop on Automotive Microelectronics and Packaging, 27-28 April 2010, Dearborn, Michigan
• Country of Publication: United States
• Language: English

Related Subjects

30 DIRECT ENERGY CONVERSION
32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION
33 ADVANCED PROPULSION SYSTEMS
CONFIGURATION
MANAGEMENT
MICROELECTRONICS
PACKAGING
PERFORMANCE
REMOVAL
SEMICONDUCTOR DEVICES
SENSITIVITY
TARGETS
thermal management
power electronics
thermal control
thermal resistance
electric vehicles