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Title: Mask roughness induced LER: a rule of thumb -- paper

Conference ·
OSTI ID:983175

Much work has already been done on how both the resist and line-edge roughness (LER) on the mask affect the final printed LER. What is poorly understood, however, is the extent to which system-level effects such as mask surface roughness, illumination conditions, and defocus couple to speckle at the image plane, and currently factor into LER limits. Here, we propose a 'rule-of-thumb' simplified solution that provides a fast and powerful method to obtain mask roughness induced LER. We present modeling data on an older generation mask with a roughness of 230 pm as well as the ultimate target roughness of 50 pm. Moreover, we consider feature sizes of 50 nm and 22 nm, and show that as a function of correlation length, the LER peaks at the condition that the correlation length is approximately equal to the resolution of the imaging optic.

Research Organization:
Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
Sponsoring Organization:
Materials Sciences Division
DOE Contract Number:
DE-AC02-05CH11231
OSTI ID:
983175
Report Number(s):
LBNL-3309E; TRN: US201014%%809
Resource Relation:
Conference: SPIE advanced lithography , San Jose, CA, February 22-25, 2010
Country of Publication:
United States
Language:
English