Micro-fabrication Techniques for Target Components
Micro-fabrication techniques, derived from the semi-conductor industry, can be used to make a variety of useful mechanical components for targets. A selection of these components including supporting cooling arms for prototype cryogenic inertial confinement fusion targets, stepped and graded density targets for materials dynamics experiments are described. Micro-fabrication enables cost-effective, simultaneous fabrication of multiple high-precision components with complex geometries. Micro-fabrication techniques such as thin-film deposition, photo-lithographic patterning and etch processes normally used in the semi-conductor manufacture industry, can be exploited to make useful mechanical target components. Micro-fabrication processes have in recent years been used to create a number of micro-electro-mechanical systems (MEMS) components such as pressure sensors, accelerometers, ink jet printer heads, microfluidics platforms and the like. These techniques consist primarily of deposition of thin films of material, photo-lithographic patterning and etching processes performed sequentially to produce three dimensional structures using essentially planar processes. While the planar technology can be limiting in terms of the possible geometries of the final product, advantages of using these techniques include the ability to make multiple complex structures simultaneously and cost-effectively. Target components fabricated using these techniques include the supporting cooling arms for cryogenic prototype fusion ignition targets, stepped targets for equation-of-state experiments, and graded density reservoirs for material strength experiments.
- Research Organization:
- Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- W-7405-ENG-48
- OSTI ID:
- 965087
- Report Number(s):
- LLNL-JRNL-404763; TRN: US200919%%457
- Journal Information:
- Fusion Science and Technology, vol. 55, no. 3, May 1, 2009, pp. 308-312, Vol. 55, Issue 3
- Country of Publication:
- United States
- Language:
- English
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