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Title: Development of New Low-Cost, High-Performance, PV Module Encapsulant/Packaging Materials: Final Technical Progress Report, 22 October 2002 - 15 November 2007

Abstract

Report on objectives to work with U.S.-based PV module manufacturers (c-Si, a-Si, CIS, other thin films) to develop/qualify new low-cost, high-performance PV module encapsulant/packaging materials, and processes using the packaging materials.

Authors:
Publication Date:
Research Org.:
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
927487
Report Number(s):
NREL/SR-520-43019
ZDO-2-30628-10; TRN: US200816%%672
DOE Contract Number:  
AC36-99-GO10337
Resource Type:
Technical Report
Resource Relation:
Related Information: Work performed by Specialized Technology Resources, Inc., Enfield, Connecticut
Country of Publication:
United States
Language:
English
Subject:
14 SOLAR ENERGY; 36 MATERIALS SCIENCE; 42 ENGINEERING; MANUFACTURERS; PACKAGING; PROGRESS REPORT; THIN FILMS; PV; CRYSTALLINE SILICON; AMORPHOUS SILICON; COPPER INDIUM DISELENIDE (CIS); MANUFACTURER; MODULE; THIN-FILM; SOLAR CELL; LOW COST; HIGH PERFORMANCE; ENCAPSULANT/PACKAGING MATERIALS; QUALIFICATION; Solar Energy - Photovoltaics

Citation Formats

Tucker, R. Development of New Low-Cost, High-Performance, PV Module Encapsulant/Packaging Materials: Final Technical Progress Report, 22 October 2002 - 15 November 2007. United States: N. p., 2008. Web. doi:10.2172/927487.
Tucker, R. Development of New Low-Cost, High-Performance, PV Module Encapsulant/Packaging Materials: Final Technical Progress Report, 22 October 2002 - 15 November 2007. United States. https://doi.org/10.2172/927487
Tucker, R. 2008. "Development of New Low-Cost, High-Performance, PV Module Encapsulant/Packaging Materials: Final Technical Progress Report, 22 October 2002 - 15 November 2007". United States. https://doi.org/10.2172/927487. https://www.osti.gov/servlets/purl/927487.
@article{osti_927487,
title = {Development of New Low-Cost, High-Performance, PV Module Encapsulant/Packaging Materials: Final Technical Progress Report, 22 October 2002 - 15 November 2007},
author = {Tucker, R},
abstractNote = {Report on objectives to work with U.S.-based PV module manufacturers (c-Si, a-Si, CIS, other thin films) to develop/qualify new low-cost, high-performance PV module encapsulant/packaging materials, and processes using the packaging materials.},
doi = {10.2172/927487},
url = {https://www.osti.gov/biblio/927487}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Apr 01 00:00:00 EDT 2008},
month = {Tue Apr 01 00:00:00 EDT 2008}
}