Atomistic modeling of shock-induced void collapse in copper
Journal Article
·
· Applied Physics Letters, vol. 86, N/A, April 18, 2005, pp. 1619021-1619023
Nonequilibrium molecular dynamics (MD) simulations show that shock-induced void collapse in copper occurs by emission of shear loops. These loops carry away the vacancies which comprise the void. The growth of the loops continues even after they collide and form sessile junctions, creating a hardened region around the collapsing void. The scenario seen in our simulations differs from current models that assume that prismatic loop emission is responsible for void collapse. We propose a new dislocation-based model that gives excellent agreement with the stress threshold found in the MD simulations for void collapse as a function of void radius.
- Research Organization:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- W-7405-ENG-48
- OSTI ID:
- 897980
- Report Number(s):
- UCRL-JRNL-210851; TRN: US200706%%170
- Journal Information:
- Applied Physics Letters, vol. 86, N/A, April 18, 2005, pp. 1619021-1619023, Journal Name: Applied Physics Letters, vol. 86, N/A, April 18, 2005, pp. 1619021-1619023
- Country of Publication:
- United States
- Language:
- English
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