skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Housing And Mounting Structure

Abstract

This invention relates to an optical transmitter, receiver or transceiver module, and more particularly, to an apparatus for connecting a first optical connector to a second optical connector. The apparatus comprises: (1) a housing having at least a first end and at least a second end, the first end of the housing capable of receiving the first optical connector, and the second end of the housing capable of receiving the second optical connector; (2) a longitudinal cavity extending from the first end of the housing to the second end of the housing; and (3) an electromagnetic shield comprising at least a portion of the housing. This invention also relates to an apparatus for housing a flexible printed circuit board, and this apparatus comprises: (1) a mounting structure having at least a first surface and a second surface; (2) alignment ridges along the first and second surfaces of the mounting structure, the alignment ridges functioning to align and secure a flexible printed circuit board that is wrapped around and attached to the first and second surfaces of the mounting structure; and (3) a series of heat sink ridges adapted to the mounting structure, the heat sink ridges functioning to dissipate heatmore » that is generated from the flexible printed circuit board.« less

Inventors:
 [1];  [1];  [1];  [1];  [1];  [1];  [2];  [3];  [1]
  1. Albuquerque, NM
  2. Kansas City, MO
  3. Sandia Park, NM
Publication Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
OSTI Identifier:
879687
Patent Number(s):
US 6863444
Application Number:
09/749285
Assignee:
EMCORE Corporation (Somerset, NJ)
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English

Citation Formats

Anderson, Gene R, Armendariz, Marcelino G, Baca, Johnny R.F., Bryan, Robert P, Carson, Richard F, Duckett, III, Edwin B., McCormick, Frederick B, Miller, Gregory V, Peterson, David W, and Smith, Terrance T. Housing And Mounting Structure. United States: N. p., 2005. Web.
Anderson, Gene R, Armendariz, Marcelino G, Baca, Johnny R.F., Bryan, Robert P, Carson, Richard F, Duckett, III, Edwin B., McCormick, Frederick B, Miller, Gregory V, Peterson, David W, & Smith, Terrance T. Housing And Mounting Structure. United States.
Anderson, Gene R, Armendariz, Marcelino G, Baca, Johnny R.F., Bryan, Robert P, Carson, Richard F, Duckett, III, Edwin B., McCormick, Frederick B, Miller, Gregory V, Peterson, David W, and Smith, Terrance T. 2005. "Housing And Mounting Structure". United States. https://www.osti.gov/servlets/purl/879687.
@article{osti_879687,
title = {Housing And Mounting Structure},
author = {Anderson, Gene R and Armendariz, Marcelino G and Baca, Johnny R.F. and Bryan, Robert P and Carson, Richard F and Duckett, III, Edwin B. and McCormick, Frederick B and Miller, Gregory V and Peterson, David W and Smith, Terrance T},
abstractNote = {This invention relates to an optical transmitter, receiver or transceiver module, and more particularly, to an apparatus for connecting a first optical connector to a second optical connector. The apparatus comprises: (1) a housing having at least a first end and at least a second end, the first end of the housing capable of receiving the first optical connector, and the second end of the housing capable of receiving the second optical connector; (2) a longitudinal cavity extending from the first end of the housing to the second end of the housing; and (3) an electromagnetic shield comprising at least a portion of the housing. This invention also relates to an apparatus for housing a flexible printed circuit board, and this apparatus comprises: (1) a mounting structure having at least a first surface and a second surface; (2) alignment ridges along the first and second surfaces of the mounting structure, the alignment ridges functioning to align and secure a flexible printed circuit board that is wrapped around and attached to the first and second surfaces of the mounting structure; and (3) a series of heat sink ridges adapted to the mounting structure, the heat sink ridges functioning to dissipate heat that is generated from the flexible printed circuit board.},
doi = {},
url = {https://www.osti.gov/biblio/879687}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Mar 08 00:00:00 EST 2005},
month = {Tue Mar 08 00:00:00 EST 2005}
}

Works referenced in this record:

Characteristics of VCSEL arrays for parallel optical interconnects
conference, May 1996


OptoElectronic Technology Consortium (OETC) parallel optical data link: components, system applications, and simulation tools
conference, January 1996

  • Wong, Y. M.; Muehlner, D. J.; Faudskar, C. C.
  • 1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference
  • https://doi.org/10.1109/ECTC.1996.517403

Parallel optical interconnections for future broad band systems, based on the "fibre in board technology"
conference, January 1996

  • De Pestel, G.; Picard, A.; Vandewege, J.
  • 1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference
  • https://doi.org/10.1109/ECTC.1996.517402

The PONI optoelectronic platform
conference, January 1999

  • Giboney, K.; Rosenberg, P.; Yuen, A.
  • 1999 IEEE LEOS Annual Meeting Conference Proceedings. LEOS'99. 12th Annual Meeting. IEEE Lasers and Electro-Optics Society 1999 Annual Meeting (Cat. No.99CH37009)
  • https://doi.org/10.1109/LEOS.1999.813458

A complete sub-system of parallel optical interconnects for telecom applications
conference, January 1996

  • Niburg, M.; Eriksen, P.; Gustafsson, K.
  • 1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference
  • https://doi.org/10.1109/ECTC.1996.517401

The PONI-1 parallel-optical link
conference, January 1999


The P-VixeLink/sup TM/ multichannel optical interconnect
conference, January 1996

  • Swirhun, S.; Dudek, M.; Neumann, R.
  • 1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference
  • https://doi.org/10.1109/ECTC.1996.517408

Polymer optical interconnect technology (POINT) optoelectronic packaging and interconnect for board and backplane applications
conference, January 1996

  • Liu, Y. S.; Wojnarowski, R. J.; Hennessy, W. A.
  • 1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference
  • https://doi.org/10.1109/ECTC.1996.517407

Gigabyte/s data communications with the POLO parallel optical link
conference, January 1996

  • Hahn, K. H.; Giboney, K. S.; Wilson, R. E.
  • 1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference
  • https://doi.org/10.1109/ECTC.1996.517406

The Jitney Parallel Optical Interconnect
conference, May 1996


1 Gb/s VCSEL/CMOS flip-chip 2-D-array interconnects and associated diffractive optics
conference, January 1999


Low-cost molded packaging for optical data links
journal, May 1995

  • Robinson, S. D.; Acarlar, M. S.; Chen, Y. C.
  • IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, Vol. 18, Issue 2
  • https://doi.org/10.1109/96.386247

Low-power modular parallel photonic data links
conference, January 1996

  • Carson, R. F.; Lovejoy, M. L.; Lear, K. L.
  • 1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference
  • https://doi.org/10.1109/ECTC.1996.551417

1-Gbyte/sec array transmitter and receiver modules for low-cost optical fiber interconnection
conference, January 1996

  • Nagahori, T.; Miyoshi, K.; Hatakeyama, I.
  • 1996 46th Electronic Components and Technology Conference, 1996 Proceedings 46th Electronic Components and Technology Conference
  • https://doi.org/10.1109/ECTC.1996.517400