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Title: Intergranular degradation assessment via random grain boundary network analysis

Patent ·
OSTI ID:874473

A method is disclosed for determining the resistance of polycrystalline materials to intergranular degradation or failure (IGDF), by analyzing the random grain boundary network connectivity (RGBNC) microstructure. Analysis of the disruption of the RGBNC microstructure may be assess the effectiveness of materials processing in increasing IGDF resistance. Comparison of the RGBNC microstructures of materials exposed to extreme operating conditions to unexposed materials may be used to diagnose and predict possible onset of material failure due to

Research Organization:
Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
DOE Contract Number:
W-7405-ENG-48
Assignee:
The United States of America as represented by the Department of Energy (Washington, DC)
Patent Number(s):
US 6397682
OSTI ID:
874473
Country of Publication:
United States
Language:
English

References (10)

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Ordered structures in random grain boundaries; some geometrical probabilities journal May 1975
The structure of high-angle grain boundaries journal November 1966
Coincidence-site lattices and complete pattern-shift in cubic crystals journal March 1974
Structure-dependence of intergranular corrosion in high purity nickel journal November 1990
A method of determining the coincidence site lattices for cubic crystals journal September 1974
Development of grain misorientation texture, in terms of coincident site lattice structures, as a function of thermomechanical treatments journal May 1989
On annealing twins and CSL distributions in F.C.C. polycrystals journal June 1992