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Title: Method using photo-induced and thermal bending of MEMS sensors

Patent ·
OSTI ID:874104
 [1]
  1. Knoxville, TN
+ Show Author Affiliations

A method for measuring chemical analytes and physical forces by measuring changes in the deflection of a microelectromechanical cantilever structure while it is being irradiated by a light having an energy above the band gap of the structure.

Research Organization:
Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
DOE Contract Number:
AC05-96OR22464
Assignee:
U.T. Battelle, LLC (Oak Ridge, TN)
Patent Number(s):
US 6312959
OSTI ID:
874104
Country of Publication:
United States
Language:
English

References (3)

Measuring intermolecular binding forces with the Atomic-Force Microscope: The magnetic jump method journal January 1994
MEMS sensors and wireless telemetry for distributed systems
  • Britton, Jr., Charles L.; Warmack, R. J.; Smith, S. F.
  • 5th Annual International Symposium on Smart Structures and Materials, SPIE Proceedings https://doi.org/10.1117/12.320161
conference July 1998
The nanomechanical NOSE
  • Lang, H. P.; Baller, M. K.; Battiston, F. M.
  • Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291) https://doi.org/10.1109/MEMSYS.1999.746743
conference January 1999

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Related Subjects

method
photo-induced
thermal
bending
mems
sensors
measuring
chemical
analytes
physical
forces
changes
deflection
microelectromechanical
cantilever
structure
irradiated
light
energy
band
gap
band gap
measuring changes
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