Heat pipe with improved wick structures

Patent · Sat Jan 01 00:00:00 EST 2000

OSTI ID:872971

Benson, David A ^[1]; Robino, Charles V ^[1]; Palmer, David W ^[1]; Kravitz, Stanley H ^[2]

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1. Albuquerque, NM
2. Placitas, NM

An improved planar heat pipe wick structure having projections formed by micromachining processes. The projections form arrays of interlocking, semi-closed structures with multiple flow paths on the substrate. The projections also include overhanging caps at their tops to increase the capillary pumping action of the wick structure. The capped projections can be formed in stacked layers. Another layer of smaller, more closely spaced projections without caps can also be formed on the substrate in between the capped projections. Inexpensive materials such as Kovar can be used as substrates, and the projections can be formed by electrodepositing nickel through photoresist masks.

• Research Organization: Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
• DOE Contract Number: AC04-94AL85000
• Assignee: Sandia Corporation (Albuquerque, NM)
• Patent Number(s): US 6056044
• OSTI ID: 872971
• Country of Publication: United States
• Language: English

Related Subjects

heat
pipe
improved
wick
structures
planar
structure
projections
formed
micromachining
processes
form
arrays
interlocking
semi-closed
multiple
flow
paths
substrate
overhanging
caps
tops
increase
capillary
pumping
action
capped
stacked
layers
layer
closely
spaced
inexpensive
materials
kovar
substrates
electrodepositing
nickel
photoresist
masks
capillary pumping
flow paths
heat pipe
flow path
closely spaced
wick structure
machining process
micromachining process
multiple flow
micromachining processes
inexpensive materials
improved wick
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