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Title: Method of using infrared radiation for assembling a first component with a second component

Patent ·
OSTI ID:872757

A method of assembling a first component for assembly with a second component involves a heating device which includes an enclosure having a cavity for inserting a first component. An array of infrared energy generators is disposed within the enclosure. At least a portion of the first component is inserted into the cavity, exposed to infrared energy and thereby heated to a temperature wherein the portion of the first component is sufficiently softened and/or expanded for assembly with a second component.

Research Organization:
Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
DOE Contract Number:
AC05-96OR22464
Assignee:
Lockheed Martin Energy Research Corporation (Oak Ridge, TN)
Patent Number(s):
US 6002110
OSTI ID:
872757
Country of Publication:
United States
Language:
English