Heat pipe with embedded wick structure

Patent · Fri Jan 01 00:00:00 EST 1999

OSTI ID:872496

Adkins, Douglas Ray ^[1]; Shen, David S ^[1]; Tuck, Melanie R ^[1]; Palmer, David W ^[1]; Grafe, V Gerald ^[2]

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1. Albuquerque, NM
2. Corrales, NM

A heat pipe has an embedded wick structure that maximizes capillary pumping capability. Heat from attached devices such as integrated circuits evaporates working fluid in the heat pipe. The vapor cools and condenses on a heat dissipation surface. The condensate collects in the wick structure, where capillary pumping returns the fluid to high heat areas.

• Research Organization: Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
• DOE Contract Number: AC04-94AL85000
• Assignee: Sandia Corporation (Albuquerque, NM)
• Patent Number(s): US 5947193
• OSTI ID: 872496
• Country of Publication: United States
• Language: English

Related Subjects

heat
pipe
embedded
wick
structure
maximizes
capillary
pumping
capability
attached
devices
integrated
circuits
evaporates
fluid
vapor
cools
condenses
dissipation
surface
condensate
collects
returns
capillary pumping
heat pipe
integrated circuits
integrated circuit
heat dissipation
wick structure
embedded wick
pumping capability
circuits evaporates
vapor cools
attached devices
maximizes capillary
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