High density electronic circuit and process for making

Patent · Fri Jan 01 00:00:00 EST 1999

OSTI ID:872364

Morgan, William P ^[1]

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1. Albuquerque, NM

High density circuits with posts that protrude beyond one surface of a substrate to provide easy mounting of devices such as integrated circuits. The posts also provide stress relief to accommodate differential thermal expansion. The process allows high interconnect density with fewer alignment restrictions and less wasted circuit area than previous processes. The resulting substrates can be test platforms for die testing and for multi-chip module substrate testing. The test platform can contain active components and emulate realistic operational conditions, replacing shorts/opens net testing.

• Research Organization: Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
• DOE Contract Number: AC04-94AL85000
• Assignee: Sandia Corporation (Albuquerque, NM)
• Patent Number(s): US 5918153
• OSTI ID: 872364
• Country of Publication: United States
• Language: English

Related Subjects

density
electronic
circuit
process
circuits
posts
protrude
surface
substrate
provide
easy
mounting
devices
integrated
stress
relief
accommodate
differential
thermal
expansion
allows
interconnect
fewer
alignment
restrictions
wasted
previous
processes
resulting
substrates
platforms
die
testing
multi-chip
module
platform
contain
active
components
emulate
realistic
operational
conditions
replacing
shorts
net
differential thermal
electronic circuit
thermal expansion
integrated circuits
integrated circuit
process allows
active components
stress relief
multi-chip module
provide easy
active component
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