Monocrystalline test structures, and use for calibrating instruments
- Frederick, MD
- Ellicott City, MD
- Ijamsville, MD
- Germantown, MD
- Albuquerque, NM
An improved test structure for measurement of width of conductive lines formed on substrates as performed in semiconductor fabrication, and for calibrating instruments for such measurements, is formed from a monocrystalline starting material, having an insulative layer formed beneath its surface by ion implantation or the equivalent, leaving a monocrystalline layer on the surface. The monocrystalline surface layer is then processed by preferential etching to accurately define components of the test structure. The substrate can be removed from the rear side of the insulative layer to form a transparent window, such that the test structure can be inspected by transmissive-optical techniques. Measurements made using electrical and optical techniques can be correlated with other measurements, including measurements made using scanning probe microscopy.
- Research Organization:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- DOE Contract Number:
- AC04-76
- Assignee:
- United States of America as represented by Secretary of Commerce (Washington, DC)
- Patent Number(s):
- US 5684301
- OSTI ID:
- 871213
- Country of Publication:
- United States
- Language:
- English
Metrology of Atomic Force Microscopy for Si Nano-Structures
|
journal | June 1995 |
A new test structure for the electrical measurement of the width of short features with arbitrarily wide voltage taps
|
journal | June 1992 |
Similar Records
Development of Thin-Window Silicon Drift Detector for X-ray Spectroscopy
Development of Thin-Window Silicon Drift Detector for X-ray Spectroscopy
Related Subjects
structures
calibrating
instruments
improved
structure
measurement
width
conductive
lines
formed
substrates
performed
semiconductor
fabrication
measurements
starting
material
insulative
layer
beneath
surface
implantation
equivalent
leaving
processed
preferential
etching
accurately
define
components
substrate
removed
rear
form
transparent
window
inspected
transmissive-optical
techniques
electrical
optical
correlated
including
scanning
probe
microscopy
transparent window
semiconductor fabrication
layer formed
starting material
surface layer
scanning probe
optical technique
probe microscopy
monocrystalline layer
crystalline layer
calibrating instruments
conductive lines
/250/257/