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Title: Particle-free microchip processing

Patent ·
OSTI ID:870442
 [1];  [2]
  1. 7723 Storrie Pl. NE., Albuquerque, NM 87109
  2. 7217 Ottawa Rd. NE., Albuquerque, NM 87109

Method and apparatus for reducing particulate contamination in microchip processing are disclosed. The method and apparatus comprise means to reduce particle velocity toward the wafer before the particles can be deposited on the wafer surface. A reactor using electric fields to reduce particle velocity and prevent particulate contamination is disclosed. A reactor using a porous showerhead to reduce particle velocities and prevent particulate contamination is disclosed.

Research Organization:
AT&T
DOE Contract Number:
AC04-76DP00789
Assignee:
Geller, Anthony S. (7723 Storrie Pl. NE., Albuquerque, NM 87109);Rader, Daniel J. (7217 Ottawa Rd. NE., Albuquerque, NM 87109)
Patent Number(s):
US 5522933
OSTI ID:
870442
Country of Publication:
United States
Language:
English

References (1)

Flow Phenomena in Chemical Vapor Deposition of Thin Films journal January 1991