Fabrication of boron sputter targets

Patent · Sun Jan 01 00:00:00 EST 1995

OSTI ID:869761

Makowiecki, Daniel M ^[1]; McKernan, Mark A ^[1]

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1. Livermore, CA

A process for fabricating high density boron sputtering targets with sufficient mechanical strength to function reliably at typical magnetron sputtering power densities and at normal process parameters. The process involves the fabrication of a high density boron monolithe by hot isostatically compacting high purity (99.9%) boron powder, machining the boron monolithe into the final dimensions, and brazing the finished boron piece to a matching boron carbide (B.sub.4 C) piece, by placing aluminum foil there between and applying pressure and heat in a vacuum. An alternative is the application of aluminum metallization to the back of the boron monolithe by vacuum deposition. Also, a titanium based vacuum braze alloy can be used in place of the aluminum foil.

• Research Organization: Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
• DOE Contract Number: W-7405-ENG-48
• Assignee: Regents Of University Of California (Oakland, CA)
• Patent Number(s): US 5392981
• OSTI ID: 869761
• Country of Publication: United States
• Language: English

Related Subjects

fabrication
boron
sputter
targets
process
fabricating
density
sputtering
sufficient
mechanical
strength
function
reliably
typical
magnetron
power
densities
normal
parameters
involves
monolithe
hot
isostatically
compacting
purity
99
powder
machining
final
dimensions
brazing
finished
piece
matching
carbide
placing
aluminum
foil
applying
pressure
heat
vacuum
alternative
application
metallization
deposition
titanium
based
braze
alloy
braze alloy
process parameters
magnetron sputter
power densities
hot isostatically
sputtering targets
vacuum deposition
magnetron sputtering
boron carbide
process involves
hot isostatic
mechanical strength
process parameter
applying pressure
boron powder
sputter target
aluminum metal
sputter targets
final dimensions
aluminum foil
boron sputter
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