Three dimensional, multi-chip module

Patent · Fri Jan 01 00:00:00 EST 1993

OSTI ID:868907

Bernhardt, Anthony F ^[1]; Petersen, Robert W ^[2]

---

1. Berkeley, CA
2. Pleasanton, CA

A plurality of multi-chip modules are stacked and bonded around the perimeter by sold-bump bonds to adjacent modules on, for instance, three sides of the perimeter. The fourth side can be used for coolant distribution, for more interconnect structures, or other features, depending on particular design considerations of the chip set. The multi-chip modules comprise a circuit board, having a planarized interconnect structure formed on a first major surface, and integrated circuit chips bonded to the planarized interconnect surface. Around the periphery of each circuit board, long, narrow "dummy chips" are bonded to the finished circuit board to form a perimeter wall. The wall is higher than any of the chips on the circuit board, so that the flat back surface of the board above will only touch the perimeter wall. Module-to-module interconnect is laser-patterned o the sides of the boards and over the perimeter wall in the same way and at the same time that chip to board interconnect may be laser-patterned.

• Research Organization: Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
• DOE Contract Number: W-7405-ENG-48
• Assignee: United States of America as represented by United States (Washington, DC)
• Patent Number(s): US 5241450
• OSTI ID: 868907
• Country of Publication: United States
• Language: English

Related Subjects

dimensional
multi-chip
module
plurality
modules
stacked
bonded
perimeter
sold-bump
bonds
adjacent
instance
fourth
coolant
distribution
interconnect
structures
features
depending
particular
design
considerations
chip
set
comprise
circuit
board
planarized
structure
formed
major
surface
integrated
chips
periphery
narrow
dummy
finished
form
wall
flat
touch
module-to-module
laser-patterned
boards
time
multi-chip modules
structure formed
circuit board
integrated circuit
major surface
circuit chip
adjacent modules
interconnect structure
circuit chips
multi-chip module
modules comprise
adjacent module
/361/257/