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Title: Method of making selective crystalline silicon regions containing entrapped hydrogen by laser treatment

Patent ·
OSTI ID:864162

A novel hydrogen rich single crystalline silicon material having a band gap energy greater than 1.1 eV can be fabricated by forming an amorphous region of graded crystallinity in a body of single crystalline silicon and thereafter contacting the region with atomic hydrogen followed by pulsed laser annealing at a sufficient power and for a sufficient duration to recrystallize the region into single crystalline silicon without out-gasing the hydrogen. The new material can be used to fabricate semi-conductor devices such as single crystalline silicon solar cells with surface window regions having a greater band gap energy than that of single crystalline silicon without hydrogen.

Research Organization:
RCA Corp
DOE Contract Number:
AC03-78ET21074
Assignee:
RCA Corporation (New York, NY)
Patent Number(s):
US 4322253
OSTI ID:
864162
Country of Publication:
United States
Language:
English