Method for joining metal by solid-state bonding

Patent · Mon Jan 01 00:00:00 EST 1979

OSTI ID:863402

Burkhart, L Elkin ^[1]; Fultz, Chester R ^[2]; Maulden, Kerry A ^[3]

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1. Oak Ridge, TN
2. Kingston, TN
3. Knoxville, TN

The present development is directed to a method for joining metal at relatively low temperatures by solid-state bonding. Planar surfaces of the metal workpieces are placed in a parallel abutting relationship with one another. A load is applied to at least one of the workpieces for forcing the workpieces together while one of the workpieces is relatively slowly oscillated in a rotary motion over a distance of about 1.degree.. After a preselected number of oscillations, the rotary motion is terminated and the bond between the abutting surfaces is effected. An additional load may be applied to facilitate the bond after terminating the rotary motion.

• Research Organization: Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
• DOE Contract Number: W-7405-ENG-26
• Assignee: United States of America as represented by United States (Washington, DC)
• Patent Number(s): US 4163516
• OSTI ID: 863402
• Country of Publication: United States
• Language: English

Related Subjects

method
joining
metal
solid-state
bonding
directed
relatively
temperatures
planar
surfaces
workpieces
placed
parallel
abutting
relationship
load
applied
forcing
slowly
oscillated
rotary
motion
distance
degree
preselected
oscillations
terminated
bond
effected
additional
facilitate
terminating
planar surfaces
rotary motion
planar surface
relatively slow
abutting relationship
solid-state bonding
metal workpieces
metal workpiece
joining metal
abutting surface
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