Creep properties of Pb-free solder joints
Describes the creep behavior of three Sn-rich solders that have become candidates for use in Pb-free solder joints: Sn-3.5Ag, Sn-3Ag-0.5Cu and Sn-0.7Cu. The three solders show the same general behavior when tested in thin joints between Cu and Ni/Au metallized pads at temperatures between 60 and 130 C. Their steady-state creep rates are separated into two regimes with different stress exponents(n). The low-stress exponents range from {approx}3-6, while the high-stress exponents are anomalously high (7-12). Strikingly, the high-stress exponent has a strong temperature dependence near room temperature, increasing significantly as the temperature drops from 95 to 60 C. The anomalous creep behavior of the solders appears to be due to the dominant Sn constituent. Joints of pure Sn have stress exponents, n, that change with stress and temperature almost exactly like those of the Sn-rich solder joints. Research on creep in bulk samples of pure Sn suggests that the anomalous temperature dependence of the stress exponent may show a change in the dominant mechanism of creep. Whatever its source, it has the consequence that conventional constitutive relations for steady-state creep must be used with caution in treating Sn-rich solder joints, and qualification tests that are intended to verify performance should be carefully designed.
- Research Organization:
- Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
- Sponsoring Organization:
- USDOE Director. Office of Science. Office of Basic Energy Sciences. Division of Materials Sciences and Engineering; Intel Corporation (US)
- DOE Contract Number:
- AC03-76SF00098
- OSTI ID:
- 838973
- Report Number(s):
- LBNL-50005; R&D Project: 511201; TRN: US200509%%89
- Journal Information:
- Journal of Materials (JOM), Vol. 54, Issue 6; Other Information: Submitted to Journal of Materials (JOM): Volume 54, No.6; Journal Publication Date: 06/2002; PBD: 1 Apr 2002
- Country of Publication:
- United States
- Language:
- English
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