Development of a high density pixel multichip module at Fermilab

Conference · Thu Mar 08 00:00:00 EST 2001

OSTI ID:775508

Cardoso, G ^[1]

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1. and others

At Fermilab, both pixel detector multichip module and sensor hybridization are being developed for the BTeV experiment. The BTeV pixel detector is based on a design relying on a hybrid approach. With this approach, the readout chip and the sensor array are developed separately and the detector is constructed by flip-chip mating the two together. This method offers maximum flexibility in the development process, choice of fabrication technologies, and the choice of sensor material. This paper presents strategies to handle the required data rate and performance results of the first prototype and detector hybridization.

• Research Organization: Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
• Sponsoring Organization: USDOE Office of Energy Research (ER) (US)
• DOE Contract Number: AC02-76CH03000
• OSTI ID: 775508
• Report Number(s): FERMILAB-Conf-01/016-E; TRN: US0101226
• Resource Relation: Conference: 51st Electronic Components and Technology Conference, Lake Buena Vista, FL (US), 05/29/2001--06/01/2001; Other Information: PBD: 8 Mar 2001
• Country of Publication: United States
• Language: English

Related Subjects

43 PARTICLE ACCELERATORS
DESIGN
FABRICATION
FLEXIBILITY
PERFORMANCE
INTEGRATED CIRCUITS
DATA ACQUISITION SYSTEMS
FERMILAB