MCM-C Multichip Module Manufacturing Guide
Abstract
Honeywell Federal Manufacturing & Technologies (FM&T) provides complete microcircuit capabilities from design layout through manufacturing and final electrical testing. Manufacturing and testing capabilities include design layout, electrical and mechanical computer simulation and modeling, circuit analysis, component analysis, network fabrication, microelectronic assembly, electrical tester design, electrical testing, materials analysis, and environmental evaluation. This document provides manufacturing guidelines for multichip module-ceramic (MCM-C) microcircuits. Figure 1 illustrates an example MCM-C configuration with the parts and processes that are available. The MCM-C technology is used to manufacture microcircuits for electronic systems that require increased performance, reduced volume, and higher density that cannot be achieved by the standard hybrid microcircuit or printed wiring board technologies. The guidelines focus on the manufacturability issues that must be considered for low-temperature cofired ceramic (LTCC) network fabrication and MCM assembly and the impact that process capabilities have on the overall MCM design layout and product yield. Prerequisites that are necessary to initiate the MCM design layout include electrical, mechanical, and environmental requirements. Customer design data can be accepted in many standard electronic file formats. Other requirements include schedule, quantity, cost, classification, and quality level. Design considerations include electrical, network, packaging, and producibility; and deliverables include finished product, drawings, documentation,more »
- Authors:
- Publication Date:
- Research Org.:
- Kansas City Plant, Kansas City, MO (US)
- Sponsoring Org.:
- US Department of Energy (US)
- OSTI Identifier:
- 768060
- Report Number(s):
- KCP-613-6384
TRN: AH200120%%420
- DOE Contract Number:
- AC04-76DP00613
- Resource Type:
- Technical Report
- Resource Relation:
- Other Information: PBD: 20 Nov 2000
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING; 32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION; CERAMICS; CLASSIFICATION; ELECTRICAL TESTING; FABRICATION; MANUFACTURING; MICROELECTRONICS; PACKAGING; RECOMMENDATIONS
Citation Formats
Blazek, R J, Kautz, D R, and Galichia, J V. MCM-C Multichip Module Manufacturing Guide. United States: N. p., 2000.
Web. doi:10.2172/768060.
Blazek, R J, Kautz, D R, & Galichia, J V. MCM-C Multichip Module Manufacturing Guide. United States. https://doi.org/10.2172/768060
Blazek, R J, Kautz, D R, and Galichia, J V. 2000.
"MCM-C Multichip Module Manufacturing Guide". United States. https://doi.org/10.2172/768060. https://www.osti.gov/servlets/purl/768060.
@article{osti_768060,
title = {MCM-C Multichip Module Manufacturing Guide},
author = {Blazek, R J and Kautz, D R and Galichia, J V},
abstractNote = {Honeywell Federal Manufacturing & Technologies (FM&T) provides complete microcircuit capabilities from design layout through manufacturing and final electrical testing. Manufacturing and testing capabilities include design layout, electrical and mechanical computer simulation and modeling, circuit analysis, component analysis, network fabrication, microelectronic assembly, electrical tester design, electrical testing, materials analysis, and environmental evaluation. This document provides manufacturing guidelines for multichip module-ceramic (MCM-C) microcircuits. Figure 1 illustrates an example MCM-C configuration with the parts and processes that are available. The MCM-C technology is used to manufacture microcircuits for electronic systems that require increased performance, reduced volume, and higher density that cannot be achieved by the standard hybrid microcircuit or printed wiring board technologies. The guidelines focus on the manufacturability issues that must be considered for low-temperature cofired ceramic (LTCC) network fabrication and MCM assembly and the impact that process capabilities have on the overall MCM design layout and product yield. Prerequisites that are necessary to initiate the MCM design layout include electrical, mechanical, and environmental requirements. Customer design data can be accepted in many standard electronic file formats. Other requirements include schedule, quantity, cost, classification, and quality level. Design considerations include electrical, network, packaging, and producibility; and deliverables include finished product, drawings, documentation, and electronic files.},
doi = {10.2172/768060},
url = {https://www.osti.gov/biblio/768060},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Mon Nov 20 00:00:00 EST 2000},
month = {Mon Nov 20 00:00:00 EST 2000}
}