Lead (Pb)-Free Solder Applications
Conference
·
OSTI ID:761872
Legislative and marketing forces both abroad and in the US are causing the electronics industry to consider the use of Pb-free solders in place of traditional Sn-Pb alloys. Previous case studies have demonstrated the satisfactory manufacturability and reliability of several Pb-free compositions for printed circuit board applications. Those data, together with the results of fundamental studies on Pb-free solder materials, have indicated the general feasibility of their use in the broader range of present-day, electrical and electronic components.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Sandia National Lab. (SNL-CA), Livermore, CA (United States)
- Sponsoring Organization:
- US Department of Energy (US)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 761872
- Report Number(s):
- SAND2000-2066C; TRN: AH200103%%10
- Resource Relation:
- Conference: EMCW 2000 Expo, Cincinnati, OH (US), 10/31/2000--11/02/2000; Other Information: PBD: 15 Aug 2000
- Country of Publication:
- United States
- Language:
- English
Similar Records
Lead-free solder technology transfer from ASE Americas
Logistics for the implementation of lead-free solders on electronic assemblies
Prototyping lead-free solders on hand-soldered, through-hole circuit boards
Conference
·
Tue Oct 19 00:00:00 EDT 1999
·
OSTI ID:761872
Logistics for the implementation of lead-free solders on electronic assemblies
Conference
·
Fri Dec 31 00:00:00 EST 1993
·
OSTI ID:761872
Prototyping lead-free solders on hand-soldered, through-hole circuit boards
Conference
·
Fri Dec 31 00:00:00 EST 1993
·
OSTI ID:761872