One-sided infrared thermal imaging for flaw characterization of ceramic matrix composites
Conference
·
OSTI ID:755880
One-sided infrared thermal imaging is being used to characterize voids and delamination in SiC/SiC composites. Flaw depth is estimated by examining the decay of surface temperature after application of a thermal pulse. Digital analysis of the surface temperature/time relationship allows characterization of the sizes and positions of defects. Results show that defects of various sizes and depths can be characterized in SiC/SiC composites with the technique.
- Research Organization:
- Argonne National Lab., IL (US)
- Sponsoring Organization:
- US Department of Energy (US)
- DOE Contract Number:
- W-31109-ENG-38
- OSTI ID:
- 755880
- Report Number(s):
- ANL/ET/CP-101896; TRN: AH200021%%91
- Resource Relation:
- Conference: 102nd Annual Meeting of the American Ceramic Society, St. Louis, MO (US), 04/30/2000--05/03/2000; Other Information: PBD: 16 May 2000
- Country of Publication:
- United States
- Language:
- English
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