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Title: Hybrid microcircuit board assembly with lead-free solders

Abstract

An assessment was made of the manufacturability of hybrid microcircuit test vehicles assembled using three Pb-free solder compositions 96.5Sn--3.5Ag (wt.%), 91.84Sn--3.33Ag--4.83Bi, and 86.85Sn--3.15Ag--5.0Bi--5.0Au. The test vehicle substrate was 96% alumina; the thick film conductor composition was 76Au--21Pt--3Pd. Excellent registration between the LCCC or chip capacitor packages and the thick film solder pads was observed. Reduced wetting of bare (Au-coated) LCCC castellations was eliminated by hot solder dipping the I/Os prior to assembly of the circuit card. The Pb-free solders were slightly more susceptible to void formation, but not to a degree that would significantly impact joint functionality. Microstructural damage, while noted in the Sn-Pb solder joints, was not observed in the Pb-free interconnects.

Authors:
; ;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Sandia National Lab. (SNL-CA), Livermore, CA (United States)
Sponsoring Org.:
US Department of Energy (US)
OSTI Identifier:
750240
Report Number(s):
SAND2000-0124C
TRN: AH200007%%101
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: APEX 2000, Long Beach, CA (US), 03/12/2000--03/16/2000; Other Information: PBD: 11 Jan 2000
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; 32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION; MATERIAL SUBSTITUTION; LEAD; SOLDERING; BRAZING ALLOYS; MICROELECTRONIC CIRCUITS; TIN BASE ALLOYS; MICROSTRUCTURE; SOLDERED JOINTS; FABRICATION

Citation Formats

Vianco, P T, Hernandez, C L, and Rejent, J A. Hybrid microcircuit board assembly with lead-free solders. United States: N. p., 2000. Web.
Vianco, P T, Hernandez, C L, & Rejent, J A. Hybrid microcircuit board assembly with lead-free solders. United States.
Vianco, P T, Hernandez, C L, and Rejent, J A. 2000. "Hybrid microcircuit board assembly with lead-free solders". United States. https://www.osti.gov/servlets/purl/750240.
@article{osti_750240,
title = {Hybrid microcircuit board assembly with lead-free solders},
author = {Vianco, P T and Hernandez, C L and Rejent, J A},
abstractNote = {An assessment was made of the manufacturability of hybrid microcircuit test vehicles assembled using three Pb-free solder compositions 96.5Sn--3.5Ag (wt.%), 91.84Sn--3.33Ag--4.83Bi, and 86.85Sn--3.15Ag--5.0Bi--5.0Au. The test vehicle substrate was 96% alumina; the thick film conductor composition was 76Au--21Pt--3Pd. Excellent registration between the LCCC or chip capacitor packages and the thick film solder pads was observed. Reduced wetting of bare (Au-coated) LCCC castellations was eliminated by hot solder dipping the I/Os prior to assembly of the circuit card. The Pb-free solders were slightly more susceptible to void formation, but not to a degree that would significantly impact joint functionality. Microstructural damage, while noted in the Sn-Pb solder joints, was not observed in the Pb-free interconnects.},
doi = {},
url = {https://www.osti.gov/biblio/750240}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jan 11 00:00:00 EST 2000},
month = {Tue Jan 11 00:00:00 EST 2000}
}

Conference:
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