Hybrid microcircuit board assembly with lead-free solders
Abstract
An assessment was made of the manufacturability of hybrid microcircuit test vehicles assembled using three Pb-free solder compositions 96.5Sn--3.5Ag (wt.%), 91.84Sn--3.33Ag--4.83Bi, and 86.85Sn--3.15Ag--5.0Bi--5.0Au. The test vehicle substrate was 96% alumina; the thick film conductor composition was 76Au--21Pt--3Pd. Excellent registration between the LCCC or chip capacitor packages and the thick film solder pads was observed. Reduced wetting of bare (Au-coated) LCCC castellations was eliminated by hot solder dipping the I/Os prior to assembly of the circuit card. The Pb-free solders were slightly more susceptible to void formation, but not to a degree that would significantly impact joint functionality. Microstructural damage, while noted in the Sn-Pb solder joints, was not observed in the Pb-free interconnects.
- Authors:
- Publication Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Sandia National Lab. (SNL-CA), Livermore, CA (United States)
- Sponsoring Org.:
- US Department of Energy (US)
- OSTI Identifier:
- 750240
- Report Number(s):
- SAND2000-0124C
TRN: AH200007%%101
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Conference
- Resource Relation:
- Conference: APEX 2000, Long Beach, CA (US), 03/12/2000--03/16/2000; Other Information: PBD: 11 Jan 2000
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING; 32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION; MATERIAL SUBSTITUTION; LEAD; SOLDERING; BRAZING ALLOYS; MICROELECTRONIC CIRCUITS; TIN BASE ALLOYS; MICROSTRUCTURE; SOLDERED JOINTS; FABRICATION
Citation Formats
Vianco, P T, Hernandez, C L, and Rejent, J A. Hybrid microcircuit board assembly with lead-free solders. United States: N. p., 2000.
Web.
Vianco, P T, Hernandez, C L, & Rejent, J A. Hybrid microcircuit board assembly with lead-free solders. United States.
Vianco, P T, Hernandez, C L, and Rejent, J A. 2000.
"Hybrid microcircuit board assembly with lead-free solders". United States. https://www.osti.gov/servlets/purl/750240.
@article{osti_750240,
title = {Hybrid microcircuit board assembly with lead-free solders},
author = {Vianco, P T and Hernandez, C L and Rejent, J A},
abstractNote = {An assessment was made of the manufacturability of hybrid microcircuit test vehicles assembled using three Pb-free solder compositions 96.5Sn--3.5Ag (wt.%), 91.84Sn--3.33Ag--4.83Bi, and 86.85Sn--3.15Ag--5.0Bi--5.0Au. The test vehicle substrate was 96% alumina; the thick film conductor composition was 76Au--21Pt--3Pd. Excellent registration between the LCCC or chip capacitor packages and the thick film solder pads was observed. Reduced wetting of bare (Au-coated) LCCC castellations was eliminated by hot solder dipping the I/Os prior to assembly of the circuit card. The Pb-free solders were slightly more susceptible to void formation, but not to a degree that would significantly impact joint functionality. Microstructural damage, while noted in the Sn-Pb solder joints, was not observed in the Pb-free interconnects.},
doi = {},
url = {https://www.osti.gov/biblio/750240},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jan 11 00:00:00 EST 2000},
month = {Tue Jan 11 00:00:00 EST 2000}
}