Slicing of silicon into sheet material. Silicon sheet growth development for the large area silicon sheet task of the Low Cost Silicon Solar Array Project. First annual report, January 9, 1976--September 19, 1976
The process of multiblade slurry sawing has been used to slice 10 cm diameter silicon ingots into wafers 0.024 cm thick using 0.050 cm of silicon per slice (0.026 cm kerf loss). Total slicing time is less than twenty hours and 143 slices were produced simultaneously. Improvements in the process will be sought to allow increased productivity by increasing blade loading, and also reduce silicon requirement per slice by reducing the blade and wafer thicknesses. The two goals require trade-offs and an economic analysis will be used to select slicing conditions for minimum wafer cost. Productivity (Slice area per hour per blade) is shown as a function of blade load and thickness, and abrasive size. Finer abrasive slurries have caused a reduction in slice productivity and thin blades caused a reduction of wafer accuracy. Sawing-induced surface damage has been shown to extend 18..mu.. into the wafer.
- Research Organization:
- Varian Associates, Lexington, MA (USA). Lexington Vacuum Div.
- DOE Contract Number:
- NAS-7-100-954374
- OSTI ID:
- 7337417
- Report Number(s):
- ERDA/JPL/954374-76/3
- Country of Publication:
- United States
- Language:
- English
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Slicing of silicon into sheet material. Silicon sheet growth development for the large area silicon sheet task of the Low Cost Silicon Solar Array Project. First quarterly report, January 9, 1976--March 21, 1976
Slicing of silicon into sheet material. Silicon sheet growth development for the large area silicon sheet task of the Low Cost Silicon Solar Array Project. Fourth quarterly report, December 20, 1976--March 20, 1977