Development of an automated encapsulation system. Final report
Early development failures in two types of high voltage electronic assemblies pointed out the inadequacies of the current encapsulation process. Voids in the mass encapsulant resulted in the destruction of the units during electrical testing in vacuum. An automated material processing system was conceived after a literature search and after new equipment with increased capabilities was observed in operation at GE's Neutron Devices Department in Florida. A prototype machine was designed and fabricated at Bendix implementing this concept. Environmental controls and new capabilities were incorporated to provide the complete process control necessary to assure void-free encapsulation of densely packaged electronic products. Machine performance was extensively evaluated to assure that all existing material specifications and quality control provisions would be met. Measurements of various material and machine characteristics showed that the operation not only is superior to the one presently being used but also provides the required additional capabilities. Material processing was also simplified which in turn made the encapsulation process more economical. In most cases, a 25 percent decrease in encapsulation costs can be anticipated.
- Research Organization:
- Bendix Corp., Kansas City, MO (United States)
- DOE Contract Number:
- EY-76-C-04-0613
- OSTI ID:
- 7218650
- Report Number(s):
- BDX-613-1493(Rev.); TRN: 77-017614
- Country of Publication:
- United States
- Language:
- English
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