Elastomeric syntactic foams for stress relief of electronic components

Conference · Sat Jan 01 00:00:00 EST 1977

OSTI ID:7087665

Rand, P. B.

Elastomeric syntactic foams have been developed for use as stress relief coatings on electronic components in encapsulated electronic assemblies. Polysulfide, silicone, and polyurethane elastomers blended with microbubbles made from glass and phenolic resins have all been used to formulate syntactic foams for various applications. These foams are used to minimize the stresses caused by differential thermal expansion between the component and the encapsulant in electronic assemblies. Compressive stress strain curves have been used to determine the effects of temperature, formulation, and test configuration on these foams. The microbubble-resin blends are fluid enough to evacuate and pour before curing. These foams may be applied using a low-pressure injection molding technique or by simply brushing or dipping. Testing techniques, necessary to evaluate these sheets of elastomeric syntactic foams, were developed. These elastomeric syntactic foams have proven to be easily formulated, versatile materials that have been used in many applications to relieve the stresses caused by differential thermal expansion.

• Research Organization: Sandia Labs., Albuquerque, N.Mex. (USA)
• DOE Contract Number: EY-76-C-04-0789
• OSTI ID: 7087665
• Report Number(s): SAND-77-1159C; CONF-771020-1
• Resource Relation: Conference: 23. technical conference of the cellular plastics division, San Francisco, California, USA, 26 Oct 1977
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ELECTRONIC EQUIPMENT
PROTECTIVE COATINGS
POLYURETHANES
FOAMS
SILICONES
SULFIDES
BUBBLES
ELASTOMERS
FABRICATION
CHALCOGENIDES
COATINGS
COLLOIDS
DISPERSIONS
ORGANIC COMPOUNDS
ORGANIC POLYMERS
PETROCHEMICALS
PETROLEUM PRODUCTS
PLASTICS
POLYAMIDES
POLYMERS
SILOXANES
SULFUR COMPOUNDS
360601* - Other Materials- Preparation & Manufacture