Detecting corrosion in plastic encapsulated micro-electronics packages
In the past, most defense microelectronics components were packaged in ceramic, hermetic enclosures. PEMs are not hermetic because the plastic molding compounds are permeable to moisture. This lack of hermeticity creates an unknown liability, especially with respect to corrosion of the metallization features. This potential liability must be addressed to ensure long-term reliability of these systems is maintained under conditions of long-term dormant storage. However, the corrosion process is difficult to monitor because it occurs under the encapsulating plastic and is therefore not visible. The authors have developed techniques that allow them to study corrosion of Al bondpads and traces under relevant atmospheric corrosion conditions. The cornerstone of this capability is the ATC 2.6, a microelectronic test device designed at Sandia National Laboratories. Corrosion tests were performed by exposing test chips to aggressive environments. The electrical response of the ATC indicated an increase in bondpad resistance with exposure time. Note that the change in resistance is not uniform from one bondpad to another. This illustrates the stochastic nature of the corrosion process. The change in resistance correlated with visual observation of corrosion of the bondpads on the unencapsulated test chips.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE Office of Environmental Restoration and Waste Management, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 674757
- Report Number(s):
- SAND-98-1510C; CONF-981108-; ON: DE98007220; BR: 4050GB010; TRN: AHC29820%%212
- Resource Relation:
- Conference: 194. meeting of the Electrochemical Society, Boston, MA (United States), 1-6 Nov 1998; Other Information: PBD: [1998]
- Country of Publication:
- United States
- Language:
- English
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