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Title: Copper corrosion in irradiated environments: The influence of H{sub 2}O{sub 2}on the electrochemistry of copper dissolution in HCl electrolyte

Abstract

The anodic dissolution of copper was examined in deaerated, 0.1 M HCl aqueous solution in the presence of H{sub 2}O{sub 2}. Concentrations of H{sub 2}O{sub 2} up to 0.2 M were studied at a rotating copper disk-platinum ring electrode. The open circuit potential (OCP) of copper was found to depend on both peroxide concentration and rotation rate. The OCP shifts towards more positive values with increasing H{sub 2}O{sub 2} concentration (C) and decreasing rotation rate. The current-voltage curves for anodic dissolution of copper were also influenced by the presence of peroxide. The curves recorded with the potential scanned in the positive direction showed the expected 60 mV slope, but the reverse scans showed significant departures. At a given potential scan rate, hysteresis was observed which was larger for higher H{sub 2}O{sub 2} concentrations, lower rotation rates, and more positive anodic potential limits. Monitoring the cuprous ions at the outer Pt ring revealed that there was a complex set of events taking place at the copper surface, including film formation and the appearance of cupric ions. 13 refs., 7 figs.

Authors:
; ; ;
Publication Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Minnesota Univ., Minneapolis, MN (United States); Belgrade Univ. (Yugoslavia). Inst. of Electrochemistry
OSTI Identifier:
60120
Report Number(s):
UCRL-95961; CONF-861207-116
ON: DE88000419
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Conference
Resource Relation:
Conference: Materials Research Society (MRS) fall meeting, Boston, MA (United States), 1-5 Dec 1986; Other Information: PBD: Dec 1986
Country of Publication:
United States
Language:
English
Subject:
05 NUCLEAR FUELS; 54 ENVIRONMENTAL SCIENCES; 36 MATERIALS SCIENCE; COPPER; CORROSION; HYDROGEN PEROXIDE; CORROSIVE EFFECTS; ELECTROCHEMISTRY; GAMMA RADIATION; RADIOACTIVE WASTES; UNDERGROUND DISPOSAL; CHEMICAL RADIATION EFFECTS; RESPONSE MODIFYING FACTORS; Yucca Mountain Project

Citation Formats

Smyrl, W H, Bell, B T, Atanasoski, R T, and Glass, R S. Copper corrosion in irradiated environments: The influence of H{sub 2}O{sub 2}on the electrochemistry of copper dissolution in HCl electrolyte. United States: N. p., 1986. Web.
Smyrl, W H, Bell, B T, Atanasoski, R T, & Glass, R S. Copper corrosion in irradiated environments: The influence of H{sub 2}O{sub 2}on the electrochemistry of copper dissolution in HCl electrolyte. United States.
Smyrl, W H, Bell, B T, Atanasoski, R T, and Glass, R S. 1986. "Copper corrosion in irradiated environments: The influence of H{sub 2}O{sub 2}on the electrochemistry of copper dissolution in HCl electrolyte". United States. https://www.osti.gov/servlets/purl/60120.
@article{osti_60120,
title = {Copper corrosion in irradiated environments: The influence of H{sub 2}O{sub 2}on the electrochemistry of copper dissolution in HCl electrolyte},
author = {Smyrl, W H and Bell, B T and Atanasoski, R T and Glass, R S},
abstractNote = {The anodic dissolution of copper was examined in deaerated, 0.1 M HCl aqueous solution in the presence of H{sub 2}O{sub 2}. Concentrations of H{sub 2}O{sub 2} up to 0.2 M were studied at a rotating copper disk-platinum ring electrode. The open circuit potential (OCP) of copper was found to depend on both peroxide concentration and rotation rate. The OCP shifts towards more positive values with increasing H{sub 2}O{sub 2} concentration (C) and decreasing rotation rate. The current-voltage curves for anodic dissolution of copper were also influenced by the presence of peroxide. The curves recorded with the potential scanned in the positive direction showed the expected 60 mV slope, but the reverse scans showed significant departures. At a given potential scan rate, hysteresis was observed which was larger for higher H{sub 2}O{sub 2} concentrations, lower rotation rates, and more positive anodic potential limits. Monitoring the cuprous ions at the outer Pt ring revealed that there was a complex set of events taking place at the copper surface, including film formation and the appearance of cupric ions. 13 refs., 7 figs.},
doi = {},
url = {https://www.osti.gov/biblio/60120}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Mon Dec 01 00:00:00 EST 1986},
month = {Mon Dec 01 00:00:00 EST 1986}
}

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