Reliability studies of metallization procedures for Kovar lead frames

Conference · Tue Jan 15 00:00:00 EST 1980

OSTI ID:5522059

Vaughn, J. G.

Five metallization procedures were evaluated to determine a manufacturing process that would produce the most solderable and reliable Kovar lead frame package. From the metallization procedures examined, it was determined that: (1) silver-copper brazes lead to liquid-metal embrittlement of the metallized Kovar; (2) nickel electroplating of the Kovar reduces, but does not eliminate, copper penetration from the silver-copper braze; (3) low cobalt-nickel electrodeposits appear to be a better diffusion barrier than high cobalt-nickel compositions: (4) nickel electroplating of the Kovar lead increases nickel contamination on the gold surface; and (5) gold plating uniformity and porosity are of major concern in lead frame processing.

• Research Organization: Bendix Corp., Kansas City, MO (USA)
• DOE Contract Number: EY-76-C-04-0613
• OSTI ID: 5522059
• Report Number(s): BDX-613-2323; CONF-800118-3
• Resource Relation: Conference: 2. AES design and finishing of printed wiring and hybrid circuits symposium, San Francisco, CA, USA, 15 Jan 1980
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
KOVAR
FABRICATION
METALLURGY
PACKAGING
PHYSICAL PROPERTIES
MICROELECTRONIC CIRCUITS
BRAZING
COBALT
COPPER
EVALUATION
GOLD
LEAD
NICKEL
POROSITY
RELIABILITY
SILVER
SOLDERING
SURFACE COATING
ALLOYS
COBALT ALLOYS
DEPOSITION
ELECTRONIC CIRCUITS
ELEMENTS
IRON ALLOYS
IRON BASE ALLOYS
JOINING
MANGANESE ADDITIONS
MANGANESE ALLOYS
METALS
NICKEL ALLOYS
TRANSITION ELEMENTS
WELDING
420800* - Engineering- Electronic Circuits & Devices- (-1989)