High performance microsystem packaging: A perspective
Conference
·
OSTI ID:542031
The second silicon revolution will be based on intelligent, integrated microsystems where multiple technologies (such as analog, digital, memory, sensor, micro-electro-mechanical, and communication devices) are integrated onto a single chip or within a multichip module. A necessary element for such systems is cost-effective, high-performance packaging. This paper examines many of the issues associated with the packaging of integrated microsystems, with an emphasis on the areas of packaging design, manufacturability, and reliability.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 542031
- Report Number(s):
- SAND-97-2010C; CONF-971092-; ON: DE98000179; TRN: 97:005616
- Resource Relation:
- Conference: ESREF `97: 8th European symposium on reliability of electron devices, Bordeaux (France), 7-10 Oct 1997; Other Information: PBD: 1997
- Country of Publication:
- United States
- Language:
- English
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