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Title: What is Scanning Probe Microscopy? And How Can It Be Used In Failure Analysis?

Abstract

Scanning probe microscopy (SPM) techniques are not suitable as global defect-localization tools. They can, however, pinpoint the exact location of the defects once the approximate locations of the defects have been identified by other failure analysis techniques. SPM techniques also provide information such as 3-D topology, current, surface potential, and 2-D dopant profile that may not be readily obtainable with other techniques. This information, coupled with the unparalleled spatial resolution and high detection sensitivity can be used by failure analysts for root cause analysis.

Authors:
;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Sandia National Lab. (SNL-CA), Livermore, CA (United States)
Sponsoring Org.:
US Department of Energy (US)
OSTI Identifier:
5010
Report Number(s):
SAND99-0710J
TRN: AH200115%%6
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Journal Article
Journal Name:
Electronics Device Failure Analysis News
Additional Journal Information:
Other Information: Submitted to Electronics Device Failure Analysis News; PBD: 26 Mar 1999
Country of Publication:
United States
Language:
English
Subject:
47 OTHER INSTRUMENTATION; DEFECTS; DETECTION; SCANNING ELECTRON MICROSCOPY; PROBES; SPATIAL RESOLUTION; SURFACE POTENTIAL; TOPOLOGY; FAILURE MODE ANALYSIS

Citation Formats

Campbell, A, and Tangyunyong, P. What is Scanning Probe Microscopy? And How Can It Be Used In Failure Analysis?. United States: N. p., 1999. Web.
Campbell, A, & Tangyunyong, P. What is Scanning Probe Microscopy? And How Can It Be Used In Failure Analysis?. United States.
Campbell, A, and Tangyunyong, P. 1999. "What is Scanning Probe Microscopy? And How Can It Be Used In Failure Analysis?". United States. https://www.osti.gov/servlets/purl/5010.
@article{osti_5010,
title = {What is Scanning Probe Microscopy? And How Can It Be Used In Failure Analysis?},
author = {Campbell, A and Tangyunyong, P},
abstractNote = {Scanning probe microscopy (SPM) techniques are not suitable as global defect-localization tools. They can, however, pinpoint the exact location of the defects once the approximate locations of the defects have been identified by other failure analysis techniques. SPM techniques also provide information such as 3-D topology, current, surface potential, and 2-D dopant profile that may not be readily obtainable with other techniques. This information, coupled with the unparalleled spatial resolution and high detection sensitivity can be used by failure analysts for root cause analysis.},
doi = {},
url = {https://www.osti.gov/biblio/5010}, journal = {Electronics Device Failure Analysis News},
number = ,
volume = ,
place = {United States},
year = {Fri Mar 26 00:00:00 EST 1999},
month = {Fri Mar 26 00:00:00 EST 1999}
}