Eutectic bonding of a Ti sputter coated, carbon aerogel wafer to a Ni foil
The formation of high energy density, storage devices is achievable using composite material systems. Alternate layering of carbon aerogel wafers and Ni foils with rnicroporous separators is a prospective composite for capacitor applications. An inherent problem exists to form a physical bond between Ni and the porous carbon wafer. The bonding process must be limited to temperatures less than 1000{degrees}C, at which point the aerogel begins to degrade. The advantage of a low temperature eutectic in the Ni-Ti alloy system solves this problem. Ti, a carbide former, is readily adherent as a sputter deposited thin film onto the carbon wafer. A vacuum bonding process is then used to join the Ni foil and Ti coating through eutectic phase formation. The parameters required for successfld bonding are described along with a structural characterization of the Ni foil-carbon aerogel wafer interface.
- Research Organization:
- Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- W-7405-ENG-48
- OSTI ID:
- 331559
- Report Number(s):
- UCRL-JC-117502; CONF-940440-; ON: DE98054506; BR: YN0100000
- Resource Relation:
- Conference: International conference on metallurgical coatings and thin films, San Diego, CA (United States), 25-29 Apr 1994; Other Information: PBD: 1 Jun 1994
- Country of Publication:
- United States
- Language:
- English
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