Application of chemical-mechanical polishing to planarization of surface-micromachined devises
- Sandia National Labs., Albuquerque, NM (United States); and others
Chemical-Mechanical Polishing (CMP) has emerged as an enabling technology for manufacturing multi-level metal interconnects used in high-density Integrated Circuits (IC). In this work we present extension of CMP from sub-micron IC manufacturing to fabrication of complex surface-micromachined Micro-ElectroMechanical Systems (MEMS). This planarization technique alleviates processing problems associated with fabrication of multi-level polysilicon structures, eliminates design constraints linked with non-planar topography, and provides an avenue for integrating different process technologies. We discuss the CMP process and present examples of the use of CMP in fabricating MEMS devices such as microengines, pressures sensors, and proof masses for accelerometers along with its use for monolithically integrating MEMS devices with microelectronics.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 231192
- Report Number(s):
- SAND-96-0944C; CONF-960673-2; ON: DE96009177
- Resource Relation:
- Conference: Solid-state sensor and actuator workshop, Hilton Head, SC (United States), 2-6 Jun 1996; Other Information: PBD: [1996]
- Country of Publication:
- United States
- Language:
- English
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